Call for Papers
Important Dates
| Regular & Special Session Papers Submission deadline: | July 7, 2026 |
| Final, Camera-Ready Papers Submission Deadline: | September 20, 2026 |
| Accepted Special Sessions Announcement: | May 28, 2026 |
Instructions for Paper Submission
- Submissions must be in PDF format and follow the IEEE conference paper templates (two-column format).
- — An IEEE conference paper template for Microsoft Word is available for download here.
- — An IEEE conference paper template for LaTeX is available for download here. Be sure to use the template’s conference mode and the A4 paper size.
- — When working in Overleaf, the template is available here.
- Initial Paper Submission
- — Regular and special session papers are to be submitted by the deadline of July 7, 2026.
- — Submissions should be three to four pages long. Do not make the paper significantly shorter than three full pages.
- — Submissions will be single-blind reviewed and must include all author names and affiliations.
- Final (Camera-Ready) Paper Submission
- — The final, camera-ready papers are to be submitted by the deadline of September 20, 2026.
- — Camera-ready papers can be three to four pages long, where the fifth page is references only. Do not make the paper significantly shorter than three full pages.
- — Authors must check PDF compatibility at IEEE PDF eXpress here before submission. Details for the PDF check will be provided soon.
- — An electronically signed IEEE Copyright Form must accompany all camera-ready paper submissions. Papers submitted without copyright forms will be rejected. Instructions for electronically signing and submitting copyright forms can be found at this site at a later time.
- — Final submissions are the camera-ready full paper that will be uploaded to IEEE Xplore.
The introduction of the paper should clearly highlight its unique aspects and how they relate to previous work. If accepted, a registered author must present the paper at the conference for it to be included in IEEE Xplore. All accepted papers will be compiled in the conference’s electronic proceedings and made available to attendees. However, papers that are not presented at the conference will be excluded from IEEE Xplore and removed from the proceedings before submission to IEEE Xplore.
The IEEE MAPCON 2026 will include the following tracks for paper submissions:
Conference Tracks
- — High power microwave tubes, Gyrotron
- — Semiconductor technologies in RF, Microwaves, mm-wave, THz
- — Passive and active RF components
- — RFICs and MMICs
- — Waveguides and plasmonic devices
- — Radar, SAR and microwave imaging
- — Microwave materials and processing
- — Wireless and cellular RF architectures
- — Mixed signal and wireline ICs
- — RF systems for telecom infrastructure
- — Automotive radars
- — Microstrip and printed antennas
- — Antenna arrays and phased arrays
- — Metamaterial and reconfigurable antennas
- — MIMO and 5G antennas
- — Millimeter-wave & Terahertz antennas
- — On-chip and wearable antennas
- — Radar imaging and beamforming
- — Scattering and diffraction
- — Electromagnetic theory
- — Computational electromagnetics
- — Electromagnetic material properties
- — Frequency-selective surfaces
- — Metamaterials and metasurfaces
- — Photonic crystals
- — Nano-electromagnetics
- — THz sources, detectors and spectroscopy
- — THz imaging and sensing
- — THz wireless communication
- — 3D THz tomography
- — Microwave photonics
- — Quantum technologies and radar
- — Free space optical communication
- — RF technologies for 5G/6G
- — MIMO antennas
- — Channel modelling
- — Reconfigurable antenna arrays
- — Underwater and non-terrestrial communications
- — Machine learning for communications
- — Quantum communications
- — Antenna measurements (near/far field)
- — High power microwave measurements
- — EMI/EMC testing and characterization
- — Characterization of antennas and radomes
- — Microwave absorbers
- — Body-area networks
- — Dosimetry and exposure assessment
- — EM imaging and diagnostics
- — Implantable and ingestible devices
- — THz imaging for biomedical applications Implantable and ingestible devices Molecular, biological and multiscale communications
- — Electromagnetic compatibility
- — EM radiation hazards
- — High-power electromagnetics
- — Spectrum compatibility and management
- — Computational electromagnetics in EMC
- — Near and far-field wireless power transfer
- — Energy harvesting and scavenging
- — High-frequency transmitters and rectifiers
- — RFID and electronic tags
- — Wearable and implantable devices
- — Microwave remote sensing
- — Quantum devices and systems
- — Software-defined and cognitive radio
- — 3D-printed microwave antennas
- — AI/ML for RF & mm-wave
- — CubeSat/NanoSat technologies
- — Weather radar systems
Paper Submission to Special Sessions
Special session paper submissions follow the regular submission process. If submitting to a special session, please ensure you select the appropriate special session during submission. The accepted special sessions will be posted on the website after May 28, 2026.
Submission Policies
IEEE mandates that authors submit original work that has neither been published elsewhere nor is under review for another publication. When submitting an article, authors are required to disclose any prior publications and current submissions. This ensures the integrity of the publication process and avoids issues related to multiple submissions or prior publications.
Procedure for Paper Submissions
Submissions will be handled through EDAS (Please see Instructions for Authors)
STEP 1:
- — Manuscripts must be a minimum of 3 pages and maximum of 4 pages in length, including text, references, and figures. The text should be in English, and should follow the IEEE Template (in Word and LaTeX formats), not exceeding 4 double-column pages.
- — A template for Microsoft Word is available for download here
- — A template for LaTeX is available for download here here (use conference mode)
- — The introduction of the paper should clearly indicate the unique aspects of the submission and how it relates to previous work.
STEP 2:
- — Submit your paper using the EDAS system. Only PDF files with all fonts embedded are accepted. Your submitted PDF file and registered EDAS account of a paper must list the same author(s), title and abstract. Papers where the PDF and EDAS account do not match the author(s), title, and/or abstract will be withdrawn by the Technical Program Co-Chairs.
- — You can review the paper and resubmit it up to the deadline. Only the last version submitted before the deadline is reviewed. Please note that once a paper has been allocated to the Technical Program Committee for review, it is no longer possible to resubmit it
- — Please select the appropriate conference track during the submission process. The organizers reserve the right to reassign the paper to a different track if necessary.
Information for authors holding a non-Indian passport
All authors holding a non-Indian passport are required to submit their passport details here and other mandatory information during paper submission to ensure smooth and expedited visa processing. Once you submit the form, IEEE MAPCON 2026 Organizing Team will provide you with an official invitation letter and the MEA clearance document (once recd. from MEA), which will help you in your visa application process. Should you have any queries, please feel free to get in touch with us mapcon2026@ieeemapcon.org.
For more visa related information, kindly visit https://ieeemapcon.org/visa-information.php
Commonly encountered problem
Please note the following commonly-encountered problem which can arise when uploading papers to EDAS. The platform can return the following error despite there being no apparent problem when visually inspecting the manuscript:
- — Upload failed: The top margin is 1.754 cm on page 4, which is below the required margin of 1.8 cm (or a similarly worded error referring to side-margins, or different measurements, or different pages).
This error often occurs when the bounding box surrounding a figure extends slightly into the margins. This is not noticeable, as the bounding box is white and is extending into a white space. A simple fix is to make the image slightly smaller, and then resubmit.
For EDAS paper submission help contact: edashelp.mapcon@gmail.com
TPC helpdesk: ieeemapcon2026chairs@gmail.com